Wire bonders

MDAWB-HC300 High grade automatic heavy wire bonder

MDAWB-HC300
产品描述：wire bonder
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DAWB-HC300 is an Automatic Aluminium Heavy Wire Bonder with adaptive closed loop ultrasonic power and bond force control capabilities. Together with intelligence contact sensing and precision motion control result to consistence and quality bonding.State-of-the-Art Control Development System (CoDeSys) enabled the digital control to the last meter which highly increases the machine reliability and scalability. Highly optimized digital image capture system greatly reduces the PR alignment time and enhance the successful rate.

MDAWB-HC300 is engineered to process a wide range of electronilc products such as electric car 18650 battery, 26800 lithium battery ,IGBT devices and most of the power devices that require heavy wire bonding.

Features:

1. High speed smart contact detection improves bond quality

2. High Speed Digital Camera for vision alignment

3. Snapshot vision system greatly improve image stability

4. Closed loop bond force control

5. Stable bond force control better bond quality and reliability

6. Programmable voice-coil bond force control system

7. Programmable ultrasonic power at various bond stages

8. Linear motorized Bond Head

9. Real time bond wire length monitoring

10.High precision linear guides and grinding grade ball screws

Technical Specifications:

Bond Head Mechatronic System

θTheta rotational axis:	+/-360 @ 0.01 degree resolution
X axis:	420mm @ 1um resolution
Y axis	360mm @ 1um resolution
Z axis:	100mm @ 1um resolution
Grinding grade ballscrew for precision and long term reliability High speed voice-coil motor for bond force control

Vision System

Camera:	Moving GE Digital Camera @640x480 pixels
lmage size:	Optic Depending

Facility Requirements

Power Supplies:	AC220V,50Hz,1000W
Optional	AC 110,50Hz

Physical Dimension

Dimension	approx. Heigh 1800mm , Width 800mm , Depth 128Cmm
Weight	approx.450 Kg

Wire Bonding Capability

Wire size:	5 mil to 20 mil(100um - 500um)
Ribbon wire :	1.4x0.25 mil to 10.0x1.0 mil
Wire Termination:	Front Cut
Wire feed system:	Motorized with High Resolution Encoder Feedback
Wire loss detection:	Encoder and Bond Power Detection Method
Maximum Wire Length:	Realtime Monitoring
Max.loop height	Programmeable
Min.loop height	Programmeable
Bond Force:	50g~3500g
Ultrasonic Transducer:	60+/-2 KHz
Ultrasonic generator:	60KHz,100W
Typical Bonding cycle time:	Productivity: Typical 3.2K wires per hour