Application:
Special for deep access bonding design in wire bonding. Reach depth about 20mm pending.
Specification:
1,electric requirement：220VAC±10％、50HZ、60W be sure connected to ground
2,wire diameter：25～50µm
3,ultrasonic power：0－3W, 60kHz, two channel. can be set separately of the two point
4,bond time：5－200ms，two channel
5,bond force:10－60g，two channel
6, span between first bond to second bond by automatic mode:0-10mm(motorized)
7,bond radian: 0-6mm(motorized)
8, jig moving area: Φ16mm
9,mouse hand:20*20mm
10,digital camera: optional
11,dimension:600*560*390mm weight:36kg
联系人：胡顺语
手机：0086-15813334038
电话：020-84789496
邮箱：md@minder-hightech.com
地址： 广州市番禺区大龙街市新路新水坑段43号813
