Application:with paltform for battery packs
High power dynatron/FET/SCR, Power module, IGBT, High power Fast recovery diode, Schottky transistor, Lead attachment, wire bonding, TO-3、TO-3P、TO-3PF、TO-3PN、TO-3PL、TO-220F、TO-126、TO-12F、TO-66、TO-251、TO-202 etc.
Specification
1,electric requiement：220VAC±10％、50HZ、be sure connected to ground
2,aluminium wire diameter：75～500μm (3～20mil)
3,ultrasonic power：0－30W, two channel.can be set separately of the two point
4,bond time：10－500ms，two channel
5,bond force:30－1200g，two channel
6,motorized Y：0－18mm
7,microscope rate：7.5 and 15
8,working area：Φ25mm
9,light：adjustable brightness
10,size：620×610×560mm
11,weight：~40kg
联系人：胡顺语
手机：0086-15813334038
电话：020-84789496
邮箱：md@minder-hightech.com
地址： 广州市番禺区大龙街市新路新水坑段43号813
