Inner diameter slicer and optical edger

ID wafer Slicer

Model:MD-45S100D
Product description: ID wafer Slicer
INQUIRY

Designed for automatically slicing semiconductor material, glass, ceramic, lithium tantalite and lithium columbate and other hard or fragile materials.

Main Features Spindle unit： It adopts vertical spindle design. It uses radial ball bearing to increase the rigidity, precision and life. Its vibration is small. Worktable unit Worktable use high precision linear guideway an AC servo system. The range of speed is wide and the low speed performance is better. It can satisfy requirements of different materials. Feeding unit Feeding system uses step motor and driving system to improve stability and precision.

MD-45S100D

□Maxima Diameter of Cutting Ingot: ＜￠100mm

□Blade Standard: φ422mm×φ152mm×0.15mm □Maximal Length of Cutting Ingot: 350mm

□Cutting feeding speed: 1〜99mm/min

□Cutting Return Speed:1〜999mm/min

□Stepping deviation of feeding system: ±0.007mm(testing with l mm feeding step)

□Range of Wafer Thickness: 0.001〜40.00mm

□Adjustment of Crystal Direction: Horizontal range（x）±7°（resolution:2')Vertical range（Y）±7º （resolution：2'）

□Power：2.5kw 〜380v±38v 50HZ±1HZ

□Source of Air：0.4〜0.5MPa □Touching Panel：5.7inch

□Dimension: 1100mm×660mm×2230mm □Weight：1100kg

□Optional Solution：