Vacuum pack system

Vacuum Parallel Seam Sealing Machine

MD-200V
Product description: Vacuum Parallel Seam Sealing Machine
INQUIRY

Introduction

The vacuum parallel sealing machine is designed for flat-sealed products such as ceramic substrates and metal lids.

It performs the sealing process in a high/low vacuum environment using parallel sealing techniques.

In this equipment, the pre-soldered substrate and lid are placed together in a vacuum chamber's XY welding platform.

The vacuum chamber is then sealed, and the vacuum evacuation and sealing process are carried out according to preset procedures and parameters.

An optional electrical activation module is available for electrode activation of products containing getters (GETTER).

This system is widely applicable for infrared detectors, gyroscopes, MEMS devices, and optical components.

Features

1. High/Low Vacuum Ceramic and Metal Sealing

2. Dual-Electrode Pre-soldering and Sealing

3. Optional Electrically Activation Module

Configuration

NAME	Qty	REMARKS
Parallel Sealing and Soldering Machine	1 unit
Welding Power Supply	1 unit
Vacuum Sealing Chamber	1 unit
Glove Box	1 set
Vacuum Oven	1 set
Tooling Fixtures (Shell and Lid)	1 set	Provided free of charge, product drawings required from the customer
Activation Module	1 set	Includes activation power supply, activation wiring, and tooling fixtures
Vacuum Pump	1 set
Molecular Pump	1 set	High vacuum molecular pump (optional)

Parameters

Welding Performance
Welding Shell Size (Array)	2mm~60mm
Drive Method	Servo motor-driven cam system
Shell Lid Alignment Accuracy	≤0.02mm
Maximum Sealing Range	≤(200×200) mm
Welding Pressure	500g to 3000g (including dead weight)
Z-Axis Stroke	35mm
Welding Speed	(0.1~50mm)/s
Device Vacuum Pressure Holding(High Vacuum Mode)	≤2Pa/5 years
Welding Leak Tightness	Meets GJB548B-2005 "Microelectronics Device Testing Methods and Procedures" requirements
Welding Power Supply
Maximum Welding Power	10KW (Nominal Power)
Maximum Output Current	3KA (Nominal Current)
Welding Frequency	8kHz
Input Voltage	380V±10% 50Hz
Vacuum Sealing Chamber
Low Vacuum Pressure	10Pa
High Vacuum Pressure	Limit 1X10^-5 Pa
Nitrogen Filling Time	Reaches atmospheric pressure ≤100S
Vacuum Pump	Rotary vane dry pump
Molecular Pump	High vacuum optional (Edwards, Leybold, Pfeiffer)
Glove Box
Glove Box Dew Point	≤-80°C
Glove Box Leakage Rate	<0.005vol%/h
Number of Gloves	2 gloves
Vacuum Oven
Oven Limit Vacuum	≤5Pa
Maximum Temperature	200°C
Heating Method	Internal panel heating
Heating Plate Dimensions	(350×230×75)mm
Heating Plate Surface Temperature Uniformity	≤±5°C (in vacuum)
Instrument Temperature Control Accuracy	±1°C
Number of Heating Layers	4 layers (inter-layer spacing 75mm), effective material placement for 3 layers
Vacuum Pump	Mechanical oil pump, dry pump (optional)
Electrical Activation Module
Voltage Range	1-24V
Current Range	0-6A
Activation Time	10-30 minutes (varies with different getters)
Product Requirements
Shell Shape	Rectangular, circular, polygonal
Lid Thickness	(0.05~0.25)mm
Shell Material	Kovar/Metallized Ceramics
Corner Shape of Rectangular Shell	R0.3~R2 (mm)
External Dimensions
Weight	Approx. 1000Kg
Equipment Dimensions	1900mm × 1000mm × 1850mm (approx.)
Environmental Requirements
Input Power Supply	AC 200V±10%, 3-phase 50Hz/60Hz, 30A
Nitrogen Pressure	0.2Mpa~0.8Mpa
Operating Environment	<10~35C 80%RH
Temperature and Humidity	-10~+65C