Semi-automatic and manual advanced wire bonder

MDZW-WB1875:Wedge-wedge Manual & semi-automatic

MDZW-BB1850:Ball-wedge Manual & semi-automatic

MDZW-BW1880:Ball-wedge & wedge-wedge Manual & semi-automatic

Product Features

1. Fixed arc height, fixed line length, automatic arc starting, improve line arc consistency

2. Real-time monitoring of solder joint deformation, effectively guaranteeing the quality of bonding solder joints

3. Manual/semi-automatic function online switching, flexible and convenient, better product compatibility

4. Ball planting wireless tail/BSOB/BBOS/adding ball position/pad ball position can be set online, automatic point alignment

5. Ball welding and wedge welding are integrated, convenient and fast switching

Performance Indicators

1.XYZ axis: travel 15mm*15mm*18mm

2.Wire diameter:Gold wire 18-75um；Platinum wire 18-25um；Aluminum wire 18-80mm；Gold belt 25*12.7μm-300*25.4μm

3.Cavity depth: compatible with 16/19mm ball welding splitter

16/19/25/32mm wedge welding splitter；Cavity depth up to 21mm

4.Bonding pressure: 5-150g, accuracy 0.1g, online programmable

5.Ultrasonic power: 0-5W, 1000 times subdivision

6. Device size: compatible with more than 200mm

7. Lifting platform size: 250mm*250mm*18mm

8. Spool size: compatible with both 1/2-inch and 2-inch spools

9. Overall dimensions: 750mm W*580mm D*500mm H

10. Weight: 80KG

11. Power supply: AC220V±10%@50HZ, 10A, less than 500W

12. Compressed air: >0.2MPa, purified air source

Product advantages

1. Manual and automatic, with the flexibility of manual machine and the consistency of semi-automatic machine

2. Ball and wedge integrated, easy to switch

3. Based on full closed-loop grating feedback, Z-axis motion accuracy is 1um, more accurate and stable

4. Based on DSP digital phase-locked technology, the transducer vibrates more evenly and stably

5. Real-time monitoring of solder joint deformation, quality assurance, high consistency

6. Wire arrangement function, manually complete the first wire, automatically complete the rest of the wire bonding, high efficiency