Reel to reel die bonder for sim cards

MDAX-860 Fully Automatic Semiconductor High Precision Solidification Machine

(Can customize to reel to reel die bonding for sim card)

一．Overview of device functions

This model is a solid crystal mount machine designed specifically for high-precision optical modules, optical devices, sensors, and various high-precision IC packaging

The MDAX-860 fully automatic high-speed solidification machine is composed of multiple sub unit modules:

1、 Linear bonding head+suction nozzle rotating structure

2、 Multi ejector pin design for easy adaptation to different types of wafer sizes

3、 1.3 million resolution visual system for chips and frameworks

4、 Servo direct connected high-precision adhesive coating system

5、 Material box feeding and receiving (customizable online mode)

6、 Solid crystal workbench module, using linear motor and high-precision grating ruler

7、 Mapping function

二.External dimensions of equipment

三．Introduction to Equipment Structure

四．Technical specifications

五．Equipment performance characteristics

1.High speed: According to customer process requirements, achieve the fastest speed in the industry

2.Placement accuracy: According to customer process requirements, achieve the highest accuracy in the industry (lithography board+chip)

Patch angle accuracy: ± 0.5 °

3.Low pressure monitoring: adjustable from 30g to 200g, with controllable error

Multiple structural configurations of Bangtou

4.Multiple image positioning schemes (appearance, feature points, edge finding, circle finding)

Control and detection of the diameter of the first adhesive point

5.     Connection mode device, multiple serial devices complete device packaging