Vacuum pack system

MDVES400 Vacuum eutectic reflow soldering oven system

Model:MDVES400
Product description: Vacuum eutectic reflow soldering oven system
INQUIRY

1、Application

IGBT modules, TR components, MCM, hybrid circuit packages, discrete device packages, sensor/MEMS packages (water-cooled), high-power device packages, optoelectronic device packages, air-tight packages (water-cooled), eutectic bump welding, etc.

2、 Product description

The design basis of the MDVES400 vacuum sintering furnace is vacuum and water cooling control, which can not only ensure the void rate, but also increase the cooling rate.

The standard gas of MDVES200 includes: nitrogen, nitrogen-hydrogen mixed gas (95%/5%) and formic acid. The customer selects the corresponding gas as the process gas according to his actual situation, and does not need to worry about the additional configuration. The PLC control system of the equipment can well monitor the operations of vacuum pumping, inflation, heating control, and water cooling to ensure the stability of the customer's process.

3、Features

1. MDVES400 is a cost-effective product with a small footprint and complete functions, which can meet customer R&D and initial production use;

2. The standard configuration of formic acid, nitrogen and nitrogen-hydrogen gas can meet the gas demand of various products of customers, without the trouble of adding process gas pipeline for the follow-up;

3. Adopting water cooling control can increase the cooling rate, so that the production rate can be increased and the production can be maximized; 4. When the customer relates to the vacuum sealing of the tube shell, the water cooling design will highlight the advantages and avoid the air cooling caused by the tube sheet and The puncture problem of the tube shell;

4、Specification

structure size
Basic frame	126011601200mm
Maximum height of base	90mm
Observation window	include
Weight	350KG
Vacuum system
Vacuum pump	Vacuum pump with oil pollution filtering device optional dry pump
Vacuum level	Up to 10Pa
Vacuum configuration	1. Vacuum pump 2. Electric valve
Pumping speed control	The pumping speed of the vacuum pump can be set by the host computer software
Pneumatic system
Process gas	N2, N2 / H2 (95% / 5%), HCOOH
First gas path	Nitrogen/nitrogen-hydrogen mixture (95%/5%)
Second gas path	HCOOH
Heating and cooling system
Heating method	Radiant heating, contact conduction, heating rate 150℃/min
Cooling method	Contact cooling, the maximum cooling rate is 120℃/min
Hot plate material	copper alloy, thermal conductivity: ≥200W/m·℃
Heating size	420*320mm
Heating device	Heating device: the vacuum heating tube is used; the temperature is collected by the Siemens PLC module, and the PID control is controlled by the host computer Advantech.
Temperature range	Max 450℃
Power requirements	380V, 50/60HZ three-phase, maximum 40A
Control System	Siemens PLC + IPC
Equipment power
Coolant	Antifreeze or distilled water ≤20℃
Pressure:	0.2～0.4Mpa
coolant flow rate	>100L/min
Water tank water capacity	≥60L
Inlet water temperature	≤20℃
Air source	0.4MPa≤air pressure≤0.7MPa
Power supply	single-phase three-wire system 220V, 50Hz
Voltage fluctuation range	single phase 200～230V
Frequency fluctuation range	50HZ±1HZ
Equipment power consumption	about 18KW; grounding resistance ≤4Ω;

5、Standard configuration

Host system	including vacuum chamber，main frame, control hardware and software
Nitrogen pipeline	Nitrogen or nitrogen/hydrogen mixture can be used as process gas
Formic acid pipeline	Bringing formic acid into the process chamber via nitrogen
Water cooling pipeline	cooling the upper cover, lower cavity and heating plate
Water cooler	Provide continuous water cooling supply to equipment
Vacuum pump	Vacuum pump system with oil mist filtration

6、Operation Conditions

Temperature	10~35℃
Relative humidity	≤75%
The environment around the equipment is clean and tidy, the air is clean, and there should be no dust or gas that can cause corrosion of electrical appliances and other metal surfaces or cause conduction between metals.