MDSYGJ-600 semiautomatic Flip chip Eutectic bonder

Introduction to Semi-automatic flip chip Eutectic bonder

MDSYGJ-600 chip bonding machine for R&D and production It can complete high-precision laser bar assembly,Including bar To subbase plate and Placement and bonding of sub-assembly to heat sink.Contrary to laser single tube,The laser bar is composed of multiple single-tube lasers with edge light emitting on a silicon bar.The output power of the beam has been significantly improved,And the application scope is expanded.Laser bar is a high power product,It is used in occasions where small and efficient light emitting units are required.The laser bar is mainly used as the pump source of the optical resonator of the high power laser, and is also often used in the medical field.

Basic equipment information

purpose：Soldering of high power semiconductor laser bar chips.

System composition：Equipment host, side camera, pressure module, mounting system with rotation, precision correction tool, heating system, inert gas protection module, self-balancing suction nozzle or module, field of view expansion module, computer control system, etc.

Mounting accuracy：Alignment accuracy after mounting and welding ± 1.5um

Mounting speed：Welding standard bar speed: ≥ 30 pieces/hour.

advantage：The independent rack ensures the stable performance and convenient movement of the equipment. The clean line provides a high-quality working environment. The touchable tablet operation button is simple and easy to understand, saving the time of large-scale training and improving the quality of training.

Introduction to equipment technical composition

1.Provide stable support for equipment, including basic mechanical and optical systems. Cooperate with a set of computer display and control system to complete processes including flip chip, eutectic soldering of face-up chip, hot plate reflow soldering, etc

2. The side camera provides the observation image of the chip side alignment, so as to ensure the accuracy of welding alignment and the controllable guarantee of pressure.

3. The equipment needs to provide appropriate patch pressure: the maximum patch pressure is not less than 30N, the patch pressure parameter is adjustable, and the adjustment resolution is not less than 0.03 N；Pressure closed-loop control, pressure and allowable range can be set.

4. The device needs to provide rotation function to ensure the parallelism between the chip and the substrate during mounting, and avoid obvious deflection. Its accuracy requires that the alignment accuracy between the chip and the reference line is ≤ ± 1um.

5. Provide a heating system that can control the heating time and speed. The heating range includes normal temperature to 400 ℃, and the heating accuracy is ≤ 2%.

6. Provide protective gas for solder, heat sink and chip during chip soldering to prevent oxidation and other adverse phenomena.

7. It has a digital vacuum sensor, which can sense whether there is chip adsorption on the chip head to prevent chip loss.

Workmanship

Pick:

Fully automatic operation

The components are fragile, and there are optical sensitive areas that cannot be touched. The edges and faces of the components are complex.

The full size of laser bar and sub-substrate requires high magnification

Welding:

Good thermal performance requires perfect coplanarity

The set stretching distance requires the highest precision after bonding to ensure the rapid heating capacity to shorten

Process time

Solder is easy to oxidize and needs to be integrated with inert gas protection function

Stacking of patches (laser bar to sub-substrate) requires different temperature curves for different solder

Inert gas protection

It can prevent and reduce the supply of formic acid gas generated by oxidation by ensuring that the gold-tin and indium solders are used as process gas in a specific protective atmosphere

Safe use of formic acid

Various standard and customized inert gas protection chambers, controllable inlet and outlet

Automatically control intake time and flow to ensure process repeatability

Workmanship

Calibration:

High-precision optical lens combination with excellent calibration based on the principle of beamformer

High-pixel resolution color camera combined with adjustable magnification optical lens barrel

Side view camera combination

Calibration means

The beamer is adjusted according to the error observed by the camera after the picked colonel and lower calibrator are imaged and aligned on the image. Adjust until the scale coincides without obvious deviation.

operation

interface:

Easy to understand

Convenient and fast operation

Intuitive data setting and observation

technical parameter：