MDLB-ASD2C2D automatic coating and developing machine

project

Specifications

remarks

1

Equipment Overview

Equipment name: Fully auto uniform glue developing machine

Equipment model: MD-2C2D6

Processing wafer specifications: compatible with 4/6-inch standard wafers

Process flow of uniform glue: Flower basket slicing → centering → uniform glue (dripping → uniform glue → edge removal, back washing) → hot plate → cold plate → basket placing

Development process flow: Flower basket slicing → centering → development (development solution → deionized water, back washing → nitrogen drying) → hot plate → cold plate → basket placing

Overall size (approximately): 2100mm (W) * 1800mm (D) * 2100mm (H)

Chemical cabinet size (approximately): 1700(W) * 800(D) * 1600mm (H)

Total weight (approximately):1000kg

Workbench height: 1020 ± 50mm

2

Cassette unit

Quantity: 2

Compatible size: 4/6 inches

Cassette detection: microswitch detection

Slide out detection: Yes, reflective sensor

3

robot

Quantity: 1

Type: Double arm vacuum adsorption robot

Degree of freedom: 4-axis (R1, R2, Z, T)

Finger material: ceramic

Substrate fixation method: vacuum adsorption method

Mapping function: Yes

Positioning accuracy: ± 0.1mm

4

Centering unit

Quantity: 1 set

Optional optical alignment

Alignment method: mechanical alignment

Centering accuracy: ± 0.2mm

5

Uniform glue unit

Quantity: 2 sets (the following are configurations for each unit)

Spindle rotation speed: -5000rpm~5000rpm

carrying idler

Spindle rotation accuracy: ± 1rpm (50rpm~5000rpm)

Minimum adjustment of spindle rotation speed: 1rpm

Maximum acceleration of spindle rotation: 20000rpm/s

carrying idler

Dripping arm: 1 set

Photoresist tube route: 2 routes

Photoresist nozzle diameter: 2.5mm

Photoresist insulation: 23 ± 0.5 ℃

optional

Moisturizing nozzle: Yes

RRC: Yes

Buffer: Yes, 200ml

Glue dropping method: center dropping and scanning dropping are optional

Edge removal arm: 1 set

Edge removal nozzle diameter: 0.2mm

Edge removal liquid flow monitoring: float flowmeter

Flow range of edge removal liquid: 5-50ml/min

Backwash pipeline: 2 ways                (4/6 inch each with 1 channel)

Backwash flow monitoring: float flowmeter

Backwash fluid flow range: 20-200ml/min

Chip fixation method: small area vacuum adsorption Chuck

Vacuum pressure alarm: digital vacuum pressure sensor

Chuck Material: PPS

Cup material: PP

Cup exhaust monitoring: digital pressure sensor

6

Developing unit

Shutter:yes

Quantity: 2 sets (the following are configurations for each unit)

Spindle rotation speed: -5000rpm~5000rpm

carrying idler

Spindle rotation accuracy: ± 1rpm (50rpm~5000rpm)

Minimum adjustment of spindle rotation speed: 1rpm

Maximum acceleration of spindle rotation: 20000rpm/s

carrying idler

Developing arm: 1 set

Developing pipeline: 2-way (fan-shaped/columnar nozzle)

Developer filtration: 0.2um

Developer temperature control: 23 ± 0.5 ℃

optional

Developing solution flow range: 100~1000ml/min

Motion mode of the developing arm: fixed point or scanning

Fusing arm: 1 set

Deionized water pipeline: 1 circuit

Deionized water nozzle diameter: 4mm (inner diameter)

Deionized water flow range: 100~1000ml/min

Nitrogen drying pipeline: 1 circuit

Nitrogen nozzle diameter: 4mm (inner diameter)

Nitrogen flow range: 5-50L/min

Developer, deionized water, nitrogen flow monitoring: float flowmeter

Backwash pipeline: 2 ways                    (4/6 inch each with 1 channel)

Backwash flow monitoring: float flowmeter

Backwash fluid flow range: 20-200ml/min

Chip fixation method: small area vacuum adsorption Chuck

Vacuum pressure alarm: digital vacuum pressure sensor

Chuck Material: PPS

Chuck Material: PPS

Cup material: PP

Cup exhaust monitoring: digital pressure sensor

7

Tackifying unit

Quantity: 2

optional

Temperature range: room temperature~180 ℃

Temperature uniformity: Room temperature~120 ℃± 0.75 ℃

120.1℃~ 180℃ ± 1.5℃

(Remove 10mm from the edge, except for the ejector pin hole)

Minimum adjustment amount: 0.1 ° C

Temperature control method: PID adjustment

PIN height range: 0-20mm

PIN material: body SUS304, PIN pin cap PI

Baking gap: 0.2mm

Overtemperature alarm: positive and negative deviation alarm

Supply method: Bubbling, 10 ± 2ml/min

Chamber operation vacuum: -5-20KPa

8

Hot plate unit

Quantity: 10

Temperature range: room temperature~250 ℃

Temperature uniformity: Room temperature~120 ℃± 0.75 ℃

120.1℃~ 180℃ ± 1.5℃  180.1℃~250℃ ±2.0℃

(Remove 10mm from the edge, except for the ejector pin hole)

Minimum adjustment amount: 0.1 ℃

Temperature control method: PID adjustment

PIN height range: 0-20mm

PIN material: body SUS304, PIN pin cap PI

Baking gap: 0.2mm

Overtemperature alarm: positive and negative deviation alarm

9

Cold plate unit

Quantity: 2

Temperature range: 15-25 ℃

Cooling method: constant temperature circulating pump cooling

10

Chemical Supply

Photoresist storage: pneumatic glue pump * 4 sets           (Optional tank or electric glue pump)

Glue dispensing volume: maximum 12ml per session, accuracy ± 0.2ml

Edge removal/back washing/RRC supply: 18L pressure tank * 2 (automatic replenishment)

Edge removal/back washing/RRC liquid level monitoring: photoelectric sensor

Photoresist liquid level monitoring: photoelectric sensor

Discharge of uniform adhesive waste liquid: 10L waste liquid tank

Developer supply: 18L pressure tank * 4         (Stored in the chemical cabinet outside the machine)

Deionized water supply: factory direct supply

Developing liquid level monitoring: photoelectric sensor

Developer waste discharge: factory waste discharge

Supply of tackifier: 10L pressure tank * 1, 2L pressure tank * 1

Level monitoring of tackifier: photoelectric sensor

11

control system

Control method: PLC

Human machine operation interface: 17 inch touch screen

Uninterruptible Power Supply (UPS): Yes

Set encryption permissions for device operators, technicians, administrators

Signal tower type: red, yellow, green 3 colors

12

System reliability indicators

Uptime: ≥95%

MTBF: ≥ 500h

MTTR: ≤ 4h

MTBA： ≥24h

Fragmentation rate: ≤ 1/10000

13

Other functions

Yellow light: 4 sets (position: above the glue mixing and development unit)

THC: Yes, 22.5 ℃± 0.5 ℃, 45% ± 2%

optional

FFU: Class 100, 5 sets (process unit and ROBOT area)