MDHX-M6000 multifunctional wedge and ball bonder

1. 1 Equipment introduction

MDHX-M6000 multifunctional wedge and ball bonder is a manual bonding equipment used to connect the chip pads to the pads on the substrate or lead frame with platinum wire, gold wire/tape, aluminum wire, silver wire or copper wire. It is a semiconductor One of the key equipment necessary for the post-packaging process on the production line.

MDHX-M6000 bonding machine has two functional modes of ball welding and wedge welding. It adopts XYZ integrated operation handle and electric brake structure, which makes the equipment operation flexible and convenient; unique ultrasonic control algorithm, stable ultrasonic output frequency and fast response speed; FPGA parallel Control algorithm design, fast bonding speed; high-precision voice coil motor force control technology and force compensation algorithm design, precise bonding pressure control, high bonding accuracy; integrated design of the whole machine, compact structure, good user experience.

1.2 Main parameters

Table 1.1 Main performance index of M6000 bonder

1.3 Equipment application fields

M6000 multifunctional wire bonder is widely used in microwave devices, hybrid circuits, RF devices/modules, discrete devices, sensors, COB modules, MCM, MEMS devices, optoelectronic devices, etc.

1. 4 Standard configuration

Table 1.2 Standard configuration of M6000 bonder

1.5 Peripheral parameters

Table 1.3 Peripheral parameters of M6000 bonder