MD-JC360-D MD-JC380-D Die bonder Technical specification | |
Worktable (Linear Module) | Optics System |
Worktable stroke:150x150mm(can customize) | Camera |
Resolution:1μm |
Optics Magnifier (wafer) :0.7 times to 4.5 times optional bigger one |
Wafer Table (Linear Module) | Cycle Time 200MS/EA |
XY stroke:8"*8"(MD-JC360-D);12"*12"(MD-JC380-D) |
Die bonding cycle is less than 250 milliseconds, production capacity is greater than 12k; |
Resolution: 1μm | |
Rotary wafer table:optional | Loading and unloading module |
Tray adapter: optional | Manual upload and download |
Wafer placement accuracy | optional magazine upload and dowload |
Adhesive die position:±25um | |
Rotation accuracy:±3° | |
Dispensing module | Equipment Require |
syringe dispensing | Voltage: AC220V/50HZ |
can perform drawing dispensing path, likd dot, line,draw etc | Air Source:minimum6BAR |
Vacuum Source:700mmHG(Vacuum pump) | |
Power Consumpion :3000w | |
PR System | Dimensions And Weight |
Method:256 grey levels | Weight :1000kg |
Detection : ink/chipping/cracked die | Size(DxWxH)外型尺寸 1300*1400*1700mm |
Monitor :17"LCD | Missing Die :yes |
Monitor Resolution:1024*768 | Vacuum Sensor |
Contact: Minder Hu
Phone: 0086-15813334038
Tel: 020-84789496
Email: md@minder-hightech.com
Add: 813,No.43,Xinshuikeng Section, Shixin Road, Dalong street,Panyu District,Guangzhou. Zip:511442