Wire bonders

MD-BT101 multifunctional bond tester for wire bonding test

MD-BT101 multifunctional bond tester

Equipment characteristics

1. All sensors adopt high-speed dynamic sensing and high-speed data acquisition systems to ensure the accuracy of test data.

2. Adopting the company's unique high-resolution (24BitPlus ultra high resolution) data acquisition system.

3. Adopting the company's unique safety limit and speed limit technology, making the operation easy and convenient.

4. Adopting the company's unique intelligent lighting control and adjustment system to reduce the damage of light sources to vision.

5. Equipped with a high-definition observation microscope as standard, reducing visual fatigue for personnel.

6. Dual rocker four way operation and user-friendly software configuration make operation simple and convenient.

7. Combining the unique design of ergonomics, making use more comfortable.

8. Comprehensive protective measures for equipment to avoid damage caused by personnel's misoperation

9. Strong R&D capabilities, providing customized products according to customer needs.

10. Attentive after-sales service ensures that users have no worries or concerns.

Test Page

Testing Parameters

Equipment model	MD-BT101
Testing accuracy	Sensor accuracy+0.003%: comprehensive testing accuracy+0.25%
Test scope	Configure different range testing modules according to customer products
Working mode	Push and pull the needle 180 degrees vertically in contact with the test product to ensure the accuracy of the data
Sensor replacement method	Manually replace the test module
operating system	Control system+Windows operating interface
Platform fixture	The machine can share various fixtures, and the fixtures can rotate 360 degrees
X-axis stroke	75mm
X-axis resolution	+/-0 002mm
Y-axis stroke	75mm
Y-axis resolution	+/-0.002mm
Z-axis stroke	80mm
Z-axis resolution	+/-0.001mm
power supply	220V±5%
power	300W(MAX)
External dimensions	L: 500mm W: :550mm H: :440mm
weight	50kg