Semiconductor industry

  • spin rinse dryer dual chamber
  • spin rinse dryer dual chamber
  • spin rinse dryer dual chamber
spin rinse dryer dual chamberspin rinse dryer dual chamberspin rinse dryer dual chamber

spin rinse dryer dual chamber

SRD spin rinse wafer dryer


Features

*Reasonable structure design and mature process technology

*Good drying effect and high process cleanliness

*Small vibration, good reliability, and applicable to thin plates

*Simple operation, convenient maintenance, stable and reliable operation of the whole machine

technical parameter

Wafer size: applicable to 1-12 inch production line

Fragment rate: 1/10000

application area

SPM acid cleaning, organic cleaning, developing, degumming, ITO etching, BOE etching, uniform gluing and other process wafer drying

Equipment function

The equipment is divided into single cavity and double cavity, which is used for wet drying of various semiconductor application materials such as 1-inch, 2-inch, 4-inch, 5-inch, 6-inch, 8-inch, 12-inch standard size wafers, non-standard size wafers and square wafers, silicon wafers, potassium nitride, gallium arsenide, sapphire, mask and so on.

process parameters

workmanship

STEP

Step1

Step2

Step3

Step4

Step5

Step6

Step7

Step8

Step9

Step10

Time (s)

0-999

0-999

0-999

0-999

0-999

0-999

0-999

0-999

0-999

0-999

speed (r/min)

0-2500

0-2500

0-2500

0-2500

0-2500

0-2500

0-2500

0-2500

0-2500

0-2500

Flushing

Optional

Optional

Optional

Optional

Optional

Optional

Optional

Optional

Optional

Optional

Purge

Optional

Optional

Optional

Optional

Optional

Optional

Optional

Optional

Optional

Optional

nitrogen

Optional

Optional

Optional

Optional

Optional

Optional

Optional

Optional

Optional

Optional

Nitrogen heating

Optional

Optional

Optional

Optional

Optional

Optional

Optional

Optional

Optional

Optional

Cavity heating

Optional

Optional

Optional

Optional

Optional

Optional

Optional

Optional

Optional

Optional

Electrostatic elimination

Optional

Optional

Optional

Optional

Optional

Optional

Optional

Optional

Optional

Optional

Equipment function

Features

*Brushless servo motor drive ensures the stability, reliability and cleanliness of the equipment.

*Labyrinth nitrogen seal, cavity and cavity isolation, non-contact sealing effect, to ensure the process environment requirements.

*PTFE pneumatic valve components, PVDF pipes and connectors are used.

*Made of 316L stainless steel, the surface is electropolished.

*The function of washing, blowing, drying and drying is to use high-speed rotating centrifugal force to remove the residual attached chemical reagent and particle dust, and clean nitrogen to take away the residual particle dust to make the product surface clean, dry and clean.

*Electrostatic elimination function. When the product moves at high speed, it will generate static electricity. Use the high-voltage electrostatic removal device to make the product surface reach the neutral state.

*Conductivity monitoring, monitoring the cleaning water quality and the residual attached chemical reagent and particle dust on the product surface, which do not meet the requirements before drying, prompt and give a warning to prevent the defective products from entering the next process.

*Stainless steel heater nitrogen heating, heating membrane cavity heating, PID temperature precision control, can choose to preheat in advance. The automatic cleaning function can be selected, and the interval can be set to ensure that the equipment is always kept clean.

*0.003UM nitrogen is filtered to ensure the cleanliness of process gas

*Mechanical self-reset function, stop and standby the cassette upward.

*Nitrogen pressure, door sealing status, cassette upward and other conditions are protected.

*The control unit is controlled independently, operates independently, and is easy to operate and maintain.



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