Application:
mainly used at silicon wafer, ceramic,glass,quartz crystal,sapphire,semiconductors precision thinning(grinding) 。
it is made from sucker, sucker main axis,grinding wheel, grinding wheel main axis,and driving part and guide screw etc.
Sucker: can be chosen to electromagnetism sucker or vacuum sucker,sucker diameter can be 320mm-600mm.
Sucker main axis driving method is frequency control of motor speed, anti-clockwise rotary,speed 3-140 adjustable.
Grinding wheel:the diameter of grinding wheel is depend on the diameter of sucker, have 150/170/210/300mm type. the granularity(roughness) of the grinding wheel is depend on the process.
Grinding wheel main axis:frequency control of motor speed, 3000-8000 adjustable.
Guide screw feeding part:high precision guide screw feeding part, serve driving, 0.001-5mm/min adjustable,it is checked by grating ruler.
this machine is very easy for operator.
Specification:
|
Sucker(chucktable) |
D320-D600 |
Main motor |
2.2kw 0-280RPM |
|
Grinding wheel |
D150-D200 |
Feed motor |
750w |
|
Workpiece Thickness b |
0.8<=b<=50mm |
Spindle |
4kw/3000-8000RPM |
|
Flatness |
+-2um(50*50) |
Sand pump motor |
250w |
|
Best workpiece diameter |
D50 |
Grating system |
0.001mm |
|
Location accuracy |
3um |
Dimension |
1125*2000*1750mm |
|
Working station |
depending |
Weight |
700kg |
|
air source |
0.6mpa |
power |
380v*3 |
联系人：胡顺语
手机：0086-15813334038
电话：020-84789496
邮箱：md@minder-hightech.com
地址： 广州市番禺区大龙街市新路新水坑段43号813
