IC/TO Package line
SOP SOT DIP TO molding machine
- 产品描述：SOP SOT DIP TO molding machine
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双油缸多齿轮组平衡系统的转进机构；
Transfer and feeding with Dual oil cylinder multi gear group balance system
优化合理的加热布控，确保模具表面各点温差≤3℃；
Optimized heating structure, ensure the surface temperature difference below 3 degree
结构更合理，拆装更方便；
Resonable structure, easier for disassembly and assembly.
硬质合金材料制成的定位系统确保产品在任意方向的错位、偏移量≤0.038mm;
The location system ensure the misplacement below 0.038mm.
