MDWF-CDA8030 Chemical Dipping Deflash machine

Application:

Used for deflash after the molding process of semiconductor IC , LED, TO, SOT, QFN, DFN etc…

According product performance and lead frame plating material, choose suitable solutions for deflash.

Normally have two solution.

1, MDWF-CDA8030(Chemical Deflash) + MDWF-WJ8030(wafer jet)

2, MDWF-EDWJ8030(Electrolysis Deflash + Water Jet)

According our experience NiPdAu plating need ED, other no need. final requirement pending on Chip performances. In MDWF-EDWJ8030 which with ED unit can also work when ED unit is selected power off.

Spec:

Suitable lead frame length:140-245mm,width: 50-80mm,thickness:0.2-3mm(can customize).

Process:

MDWF-CDA8030(Chemical Deflash): Automatic upload >>chemical immerse>>bubble cleaning(optional ultrasonic cleaning)>>download.

MDWF-WJ8030(water jet): Automatic upload>>water jet>>ultrasonic cleaning>>spray drying>>oven drying>>download.

MDWF-EDWJ8030(Electrolysis Deflash + Water Jet): Automatic upload>>Electrolysis deflash>>water jet>>ultrasonic cleaning>>spray drying>>oven drying>>download.

Character and basic configuration:

Water jet unit: jet nozzle:16pcs diamond nozzle; 1pcs 30HP high pressure pump. automatic pressure adjustment system.

Ultrasonic unit: 600W(1000mm)

Spray drying: 7set air nozzle,7.5kw/set. (1150mm)

Oven drying: 120C degree, (1000mm)

Size:

MDWF-CDA8030(Chemical Deflash): 2800*1500*2000mm customize

MDWF-WJ8030(water jet):4800*1100*1600mm (customize)

MDWF-EDWJ8030(Electrolysis Deflash + Water Jet): 10800*1100*1600mm (customize)