Semiconductor industry

MDHWS321 Ultrasonic scanning microscope in semiconductor

MDHWS321
产品描述：ultrasonic scanning microscope
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MDHWS321 Ultrasonic scanning microscope

1. Basic Information

Electromechanical characteristics	Specification
Machine size	750mm×700mm×1350mm
Sink size	350mm×220mm×120mm
Effective scanning scanning	260mm×100mm×50mm
Maximum scanning speed	300mm/s
Image recommendation resolution	1～4000um
positioning accuracy	X/Y≤±1μm，Z≤±10μm
Repeatability	X/Y≤±0.01mm，Z≤±0.02mm
Plumbing	Adapt to the water supply and drainage device, and manually control the water injection and drainage process of the water tank system.

2. Factory installation conditions

2.1 Machine size

750mm（L）×700mm（W）×1350mm（H）, The installation scheme is based on the need for minimizing space occupation and optimization/service conditions to ensure that there is 500mm space around the device, which can facilitate the operation and maintenance of the staff.

2.2 Computer Desk

The device is equipped with a computer table for placing mouse, keyboard and display. Users can also be equipped by themselves.

2.3 electricity supply

Working power supply：220V±10%/50Hz，1~2KW

The device is equipped with a regulator to ensure stable voltage.

2.4 Water source: Equipment requires tap water, ion water or pure water, and needs to be replaced regularly. Water temperature requirements: 15-30 ℃

2.5 Environmental relative humidity: 35 ℃ ≤50 % RH

2.6 Environmental temperature requirements: 20 ～ 35 ℃

2.7 Surroundings:

Do not put it next to the strong magnetic field, electromagnetic wave, and high -frequency device.

Reduce vibration.

Please place in places where there is less dust, less moisture, and no corrosive gas.

The changes in the power supply are limited to the minimum.

To prevent the damage to the earthquake, it must be fixed around.

3. The main configuration table

No.	Name	Specification
1	Scanning system	X, Y axis: servo motor driver; Z -axis: step motor driver; automatic push rod system: step motor driver;
2	Sink	350mm x 220mm x 120 mm
3	Ultrasonic launch, receiver	Bandwidth 1-65MHz
4	High -speed data collection card	Sampling frequency 500MHz
5	Ultrasonic probe	With a 50MHz0.5in probe, a set of transmission modules;
6	Work control computer	I5 processor, memory 4GB, hard disk 1T, Win7 32 -bit operating system.
7	Display	21.5 "LCD display*2
8	Plumbing	Adapt to the water supply and drainage device, and manually control the water injection and drainage process of the water tank system.
9	Detection software	Water immersion ultrasonic rapid detection software V1.0

4. Layer detection capability of semiconductor chip packaging

Measuring ability	Capability description
Standard block measurement error	Measurement of the standard block of mechanical processing, under the premise of the software for strength calibration, the multiple measurement error of the ultrasonic detection is ± 1%.
Workpiece measurement error	Select the TO series, SOT series, SOP and other series of workpieces, and adjust the gain of 22DB, 26DB, and 30DB of the same square and the detection procedure of the same square and the detection procedure. The three test results are within ± 1%.
Thickness measurement range	Epoxy： Cu： 0.5 ~ 2mm（50MHz Probe） 0.5 ~ 1.4mm（25MHz Probe） 1.0 ~ 4.0mm（15MHz Probe） 1.2 ~ 3.7mm（15MHz Probe） Note: Select the probe according to the materials and thickness of the customer workpiece
Defect recognition ability	Within the thickness range of the measurement system, the sound speed of the tested material is within ± 5%of the standard material speed, and the recognition ability of the horizontal direction of the measured product of the measured product with the surface of the ultrasonic incident is 0.15 mm (15MHz, 25MHz Probe) and 0.07 mm (50MHz probe).

5. Software function

Software function	Capability description
Manual scanning	The C scan image can be generated in a manual way to reflect the binding of the welding binding surface, and the detection results are displayed in the form of a natal value such as the rate of stabilization and the area of defects.
Probe and C sweeping image opposite	Can move the probe to the position corresponding to the actual inspector by clicking the specific pixels of C scanning.
Manual analysis	The generated C -sweeping pictures can be edited by various editors, including the frame (confirming the effective analysis area), the ranging, modification of the threshold, the tailoring of the picture, and the surface compensation.
Multiple scan modes	(1) A scan: View ultrasound reflection or transmission waveform; (2) C scan: scan and imagite along the X-Y plane in the depth of focus; (3) Regional scanning: can customize the detection area and scan the detection area; (4) Batch scanning: Automatic detection of one or more workpieces placed in the sink.
Report automatically	The test results can be automatically edited and the report document can be exported.
Probe management	Can be replaced or edited on different types of probes.
One -click automatic calibration	It can automatically change the energy changes of the detection equipment coordinate and detect the system. It can calibrate the system drift in real time to ensure the accuracy and stability of the detection results.
Stainless steel standard strength	The system comes with the stainless steel standard block of the GBT 11259-2015 "The Making and verification Method of the Steel Testing Block of the Steel Testing Block". The ultrasound reflection strength of the stainless steel standard block = 100 stss (abbreviation of "Stainless Steel Standard"), the detection of all other materials is compared to the Stss.
Defect detection function	Welding defects, adhesion defects, packaging layers, empty pieces and other areas and good areas. Automatic statistics and calculations on defect size and area can be performed. You can also provide compensation and development services according to the customer's requirements。
Thickness detection	Vajrayana and other workpieces of diamonds are detected.
Density detection	Fan Metallurgical raw material density distribution detection.
Sound speed detection	The speed of the sound in the measured material was detected.