Inner diameter slicer and optical edger

  • Inner diameter circle slicer
Inner diameter circle slicer

Inner diameter circle slicer

  • MD-IDC50100
  • 产品描述：Inner diameter circle slicer
  • 在线订购
Details
Inner circle fully automatic slicing machine is using inside circle to cut a variety of
semiconductors, crystal, ceramic, NdFeB magnetic material.
Installed in the spindle, the edge-type Diamond blade cutter is high-speed
rotating, the table was feeding by computer control of horizontal and vertical
movement, the material on the fixture of the table was cut into the required
product.
We have the semi-automatic/fully automatic inner circle clicking machine, within
a circle slicer two kinds of specifications, a variety of models.
For the Automatic Slicer inner circle. a worker can operate about 16 units slicer

at the same time


MD-IDC50100
Main technical parameters
Max machining size(mm):φ115 ×80mm

english interface

touch screen

Max machining size(mm):D115 ×80 mm

Cutting speed （mm/min):0.3-60(mm／min)

Degree of balance sheets by cutting deviation（mm)平：±0.01 ㎜  

Cutting film thickness(mm):≥0.30

The thin-cut tolerance (mm): ±０.01㎜

Horizontal stroke（mm):120㎜

Longitudinal travel(mm):110㎜

Longitudinal degrees:0-100Grid,

each grid:0.01

Each turn a lap in order to:1㎜

Spindle Electrical:3 Phase 380V 0.75kw

Spindle Speed (r/min):2300Rev / min

Adjust the amount of work table:

Horizontal angle:±45º

Pitch angle of elevation:±10º

Vertically（mm):24

Cooling tank capacity（kg）:50kg

Cooling tank motor: 3 Phase 380V 0.12kw 2780r/min

Main Power :Three-phase four-wire 50Hz 380V

Dimensions(mm):1200 ×900 ×1600

Weight（kg):~1000（kg）

Weight（kg):~1600（kg）


上一个： MD-IDC9580 Inner diameter circle slicer 下一个：ID wafer Slicer

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