Automatic wafer mounter for dicing

Model

MDHYM80

MDHYM120

MDHYM82

MDHYM122

Maximum size of wafer

6’’&8’’

12”

6’’&8’’

12”

Wafer thickness

150-800μm

150-800μm

150-750μm

150-750μm

Membrane type

Blue membrane&UV membrane

Membrane thickness

0.05-0.2mm

Membrane length

≤100m

Membrane width

270-330mm

330-400mm

270-330mm

330-400mm

Workbench

Anti static Teflon treatment

Heating temperature

Room temperature 150 ℃

Efficiency

80pcs/h

70pcs/h

80pcs/h

70pcs/h

Air supply

0.5Mpa clean dry compressed air

Power supply

AC220V,10A

AC220V,10A

AC220V,16A

AC220V,16A

Overall dimension

W*D*H

360mm*860mm*560mm

560mm*1000mm*600mm

600mm*960mm*500mm

660mm*1100mm*500mm

Weight

50kg

60kg

80kg

110kg

Functional features

Advanced anti-static roller film

Manual film pulling and sticking

Manual wafer loading and unloading

Circular knife elastic structure, film cutting force is adjustable

Reasonable structure and convenient tool change

Worktable floating design, height adjustable

Automatic winding and recovery of release film

It can be customized according to demand

Advanced anti-static roller film

Anti electrostatic ion fan

Automatic film transfer and coating

Film pressure and speed can be adjusted

Manual wafer loading and unloading

Touch screen operation panel

Program control based on PLC

It can be customized according to demand